13–14
Altera Corporation
Stratix Device Handbook, Volume 2
July 2005
Package Outlines
1,508-Pin FineLine BGA - Flip Chip
■
All dimensions and tolerances conform to ASME Y14.5M - 1994.
■
Controlling dimension is in millimeters.
■
Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
outline figure references, respectively, for the 1,508-pin FineLine BGA
packaging.
Table 13–13. 1,508-Pin FineLine BGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FineLine BGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034
Variation: AAU-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
14.6 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 13–14. 1,508-Pin FineLine BGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
Max.
A–
–
3.50
A1
0.30
–
A2
0.25
–
3.00
A3
–
2.50
D
40.00 BSC
E
40.00 BSC
b
0.50
0.60
0.70
e
1.00 BSC
