參數(shù)資料
型號(hào): EDS2532AABJ-6B
廠商: Elpida Memory, Inc.
英文描述: 256M bits SDRAM (8M words ?32 bits)
中文描述: 256M位的SDRAM(800萬(wàn)字?32位)
文件頁(yè)數(shù): 7/48頁(yè)
文件大?。?/td> 614K
代理商: EDS2532AABJ-6B
EDS2532AABJ-6B
Data Sheet E0509E30 (Ver. 3.0)
7
AC Characteristics (TA = 0 to +70
°
C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V)
-6B
Parameter
Symbol
min.
max.
Unit
Notes
System clock cycle time
(CL = 2)
tCK
ns
1
(CL = 3)
tCK
6
ns
1
CLK high pulse width
tCH
2.5
ns
1
CLK low pulse width
tCL
2.5
ns
1
Access time from CLK
tAC
5.4
ns
1, 2
Data-out hold time
tOH
2.0
ns
1, 2
CLK to Data-out low impedance
tLZ
0
ns
1, 2, 3
CLK to Data-out high impedance
tHZ
5.4
ns
1, 4
Input setup time
tSI
1.5
ns
1
Input hold time
tHI
0.8
ns
1
Ref/Active to Ref/Active command period
tRC
60
ns
1
Active to Precharge command period
tRAS
42
120000
ns
1
Active command to column command (same bank)
tRCD
18
ns
1
Precharge to active command period
tRP
18
ns
1
Write recovery or data-in to precharge lead time
tDPL
12
ns
1
Last data into active latency
tDAL
2CLK + 18ns —
Active (a) to Active (b) command period
tRRD
12
ns
1
Transition time (rise and fall)
tT
0.5
5.0
ns
Refresh period (4096 refresh cycles)
tREF
64
ms
Notes: 1. AC measurement assumes tT = 0.5ns. Reference level for timing of input signals is 1.4V.
2. Access time is measured at 1.4V. Load condition is CL = 30pF.
3. tLZ (min.) defines the time at which the outputs achieves the low impedance state.
4. tHZ (max.) defines the time at which the outputs achieves the high impedance state.
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