參數(shù)資料
型號： DSP56F801FA80E
廠商： Freescale Semiconductor
文件頁數(shù)： 38/48頁
文件大?。?/td> 0K
描述： IC DSP 60MHZ 16KB FLASH 48-LQFP
標準包裝： 250
系列： 56F8xx
核心處理器： 56800
芯體尺寸： 16-位
速度： 80MHz
連通性： SCI，SPI
外圍設備： POR，PWM，WDT
輸入/輸出數(shù)： 11
程序存儲器容量： 20KB（10K x 16）
程序存儲器類型： 閃存
RAM 容量： 2K x 16
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉換器： A/D 8x12b
振蕩器型： 內部
工作溫度： -40°C ~ 85°C
封裝/外殼： 48-LQFP
包裝： 托盤
Thermal Design Considerations
56F801 Technical Data, Rev. 17
Freescale Semiconductor
43
Part 5 Design Considerations
5.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
Equation 1:
Where:
TA = ambient temperature °C
RθJA = package junction-to-ambient thermal resistance °C/W
PD = power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance:
Equation 2:
Where:
RθJA = package junction-to-ambient thermal resistance °C/W
RθJC = package junction-to-case thermal resistance °C/W
RθCA = package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
Definitions:
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the
chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation
across the surface.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
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相關代理商/技術參數(shù)
參數(shù)描述
DSP56F801FA80E 制造商:Freescale Semiconductor 功能描述:IC
DSP56F801PB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:16-bit Digital Signal Processor
DSP56F802 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
DSP56F802PB 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56F802 16-Bit Hybrid Controller Product Brief
DSP56F802TA60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60Mhz/30MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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