參數(shù)資料
型號(hào): DS3112N
廠商: DALLAS SEMICONDUCTOR
元件分類: Digital Transmission Controller
英文描述: DATACOM, FRAMER, PBGA256
封裝: 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù): 69/134頁
文件大?。?/td> 900K
代理商: DS3112N
DS3112
4 of 134
SECTION 1: INTRODUCTION
The DS3112 TEMPE (T3 E3 MultiPlexEr) device can be used either as a multiplexer or a T3/E3 framer.
When the device is used as a multiplexer, it can be operated in one of three modes:
M13 – multiplex 28 T1 lines into a T3 data stream
E13 – multiplex 16 E1 lines into a E3 data stream
G747 – multiplex 21 E1 lines into a T3 data stream
See Figures 1A, 1B, and 1C for block diagrams of these three modes. In each of the block diagrams, the
receive section is at the bottom and the transmit section is at the top. The receive path is defined as
incoming T3/E3 data and the transmit path is defined as outgoing T3/E3 data. When the device is
operated solely as a T3 or E3 framer, the multiplexer portion of the device is disabled and the raw T3/E3
payload will be output at the FRD output and input at the FTD input. See Figures 1A and 1B for details.
In the receive path, raw T3/E3 data is clocked into the device (either in a bipolar or unipolar fashion) with
the HRCLK at the HRPOS and HRNEG inputs. The data is then framed by the T3/E3 framer and passed
through the two step demultiplexing process to yield the resultant T1 and E1 data streams which are
output at the LRCLK and LRDAT outputs. In the transmit path, the reverse occurs. The T1 and E1
datastreams are input to the device at the LTCLK and LTDAT inputs. The device will sample these
inputs and then multiplex the T1 and E1 datastreams through a two step multiplexing process to yield the
resultant T3 or E3 datastream. Then this datastream is passed through the T3/E3 formatter to have the
framing overhead added, and the final datastream to be transmitted is output at the HTPOS and HTNEG
outputs using the HTCLK output.
The DS3112 has been designed to meet all of the latest telecommunications standards. Table 1A is list of
all of the applicable standards for the device.
The TEMPE device has a number of advanced features such as:
the ability to drop and insert up to two T1 or E1 ports
an onboard HDLC controller with 256 byte buffers
an onboard Bit Error Rate Tester (BERT)
advanced diagnostics to create and detect many different types of errors
See Table 1B for a complete list of main features within the device.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112N+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112NC1 制造商:Maxim Integrated Products 功能描述:T3 E3 MULTIPLEXER, 3.3V T3/E3 FRAMER AND M13/E13/G.747 MUX - Rail/Tube
DS3112ND1E 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS3112RD 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray