參數(shù)資料
型號(hào): DRV591GQE
英文描述: Analog IC
中文描述: 模擬IC
文件頁(yè)數(shù): 18/19頁(yè)
文件大小: 256K
代理商: DRV591GQE
DRV591
SLOS389
NOVEMBER 2001
18
www.ti.com
MECHANICAL DATA
VFP (S-PQFP-G32)
PowerPAD
PLASTIC QUAD FLATPACK
4200791/A 04/00
Gage Plane
Seating Plane
1,60 MAX
1,45
1,35
8,80
9,20
SQ
0,05 MIN
0,45
0,75
0,25
0
°
7
°
0,13 NOM
5,60 TYP
7,20
6,80
1
32
24
25
SQ
8
9
17
16
0,30
0,45
(See Note D)
Thermal Pad
M
0,22
0,10
0,80
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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