
CY25000
Document #: 38-07424 Rev. *B
Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Page 9 of 10
All product and company names mentioned in this document are the trademarks of their respective holders.
Package Drawing and Dimensions
Note:
6. “XXX” denotes the assigned product number. “W” denotes the different programmed spread % values. The user can request different spread % values.
SEATING PLANE
PIN 1 ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
8 Lead (150 Mil) SOIC - S08
1
4
5
8
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
51-85066-*C