參數(shù)資料
型號(hào): C9630CY
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: XO, clock
英文描述: PC133 Clock Generator for SiS630/Pentium III & SiS540/Socket7 Applications
中文描述: 150 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
封裝: SSOP-48
文件頁(yè)數(shù): 16/18頁(yè)
文件大小: 185K
代理商: C9630CY
PC133 Clock Generator for SiS630/Pentium
III & SiS540/Socket7 Applications
Cypress Semiconductor Corporation
525 Los Coches St.
Milpitas, CA 95035. Tel: 408-263-6300, Fax: 408-263-6571
http://www.cypress.com
Document#: 38-07035 Rev. **
05/02/2001
Page 16 of 18
APPROVED PRODUCT
C9630
Suggested Oscillator Crystal Parameters
Characteristic
Symbol
Frequency
F
o
Tolerance
T
C
T
S
T
A
Operating Mode
-
Load Capacitance
C
XTAL
Effective Series
Resistance (ESR)
Note1: For best performance and accurate frequencies from this device, It is recommended but not mandatory that the
chosen crystal meets or exceeds these specifications
Note 2: Larger values may cause this device to exibit oscillator startup problems
Min
12.00
-
-
-
-
-
-
Typ
Max
16.00
+/-100
+/- 100
5
-
-
-
Units
MHz
PPM
PPM
PPM
Conditions
14.31818
-
-
-
-
16
40
Note 1
Stability (T
A
-10 to +60C) Note 1
Aging (first year @ 25C) Note 1
Parallel Resonant, Note 1
The crystal
s rated load. Note 1
Note 2
pF
R
ESR
Ohms
To obtain the maximum accuracy, the total circuit loading capacitance should be equal to C
XTAL
. This loading
capacitance is the effective capacitance across the crystal pins and includes the clock generating device pin
capacitance (C
FTG
), any circuit traces (C
PCB
), and any onboard discrete load capacitors (C
DISC
).
The following formula and schematic may be used to understand and calculate either the loading specification of a crystal for a
design or the additional discrete load capacitance that must be used to provide the correct load to a known load rated crystal.
C
L
= (C
XINPCB
+ C
XINFTG
+ C
XINDISC
) X (C
XOUTPCB
+ C
XOUTFTG
+ C
XOUTDISC
)
(C
XINPCB
+ C
XINFTG
+ C
XINDISC
) + (C
XOUTPCB
+ C
XOUTFTG
+ C
OUTDISC
)
Where:
C
XTAL
= the load rating of the crystal
C
XOUTFTG
= the clock generators XIN pin effective device internal capacitance to ground
C
XOUTFTG
= the clock generators XOUT pin effective device internal capacitance to ground
C
XINPCB
= the effective capacitance to ground of the crystal to device PCB trace
C
XOUTPCB
= the effective capacitance to ground of the crystal to device PCB trace
C
XINDISC
= any discrete capacitance that is placed between the XIN pin and ground
C
XOUTDISC
= any discrete capacitance that is placed between the XOUT pin and ground
C
XINPCB
C
XOUTPCB
C
XOUTDISC
C
XINDISC
C
XINFTG
C
XOUTFTG
XIN
XOUT
Clock Generator
As an example, and using this formula for this datasheet
s device, a design that has no discrete loading capacitors
(C
DISC
) and each of the crystal to device PCB traces has a capacitance (C
PCB
) to ground of 2pF (typical value) would
calculate as:
C
L
= (2pF + 30pF
+ 0pF) X (2pF + 30pF
+ 0pF) = 32 X 32 = 16 pF
(2pF + 30pF
+ 0pF) + (2pF + 30pF
+ 0pF) 32 + 32
Therefore to obtain output frequencies that are as close to this data sheets specified values as possible, in this design
example, you should specify a parallel cut crystal, with C
L
= 16pF.
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