參數(shù)資料
型號: AT32UC3A3-XPLD
廠商: Atmel
文件頁數(shù): 65/94頁
文件大?。?/td> 0K
描述: KIT DEV/EVAL FOR AT32UC3A3
產(chǎn)品培訓模塊: AVR® UC3 Introduction
Sensors Xplained
標準包裝: 1
系列: AVR®32 UC3-A3 Xplained
類型: MCU
適用于相關(guān)產(chǎn)品: AT32UC3A3
所含物品:
68
32072SH–AVR32–10/2012
AT32UC3A3
8.
Mechanical Characteristics
8.1
Thermal Considerations
8.1.1
Thermal Data
Table 8-1 summarizes the thermal resistance data depending on the package.
8.1.2
Junction Temperature
The average chip-junction temperature, T
J, in °C can be obtained from the following:
1.
2.
where:
θ
JA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1 on page
θ
JC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
θ
HEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
P
D = device power consumption (W) estimated from data provided in the section ”Regulator
T
A = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
J in °C.
Table 8-1.
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
Unit
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP144
40.3
°C/W
θ
JC
Junction-to-case thermal resistance
TQFP144
9.5
θ
JA
Junction-to-ambient thermal resistance
Still Air
TFBGA144
28.5
°C/W
θ
JC
Junction-to-case thermal resistance
TFBGA144
6.9
θ
JA
Junction-to-ambient thermal resistance
Still Air
VFBGA100
31.1
°C/W
θ
JC
Junction-to-case thermal resistance
VFBGA100
6.9
TJ
TA
PD θJA
×
()
+
=
TJ
TA
P
(
D
θ
(
HEATSINK
×θ
JC ))
++
=
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