參數(shù)資料
型號: AM45DL3208GB70IS
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁數(shù): 64/66頁
文件大?。?/td> 1196K
代理商: AM45DL3208GB70IS
62
Am45DL3208G
March 12, 2004
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
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AM45DL3208GB70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM45DL3208GT70IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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參數(shù)描述
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AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM