參數(shù)資料
型號(hào): AM45DL3208GB70IS
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 54/66頁(yè)
文件大?。?/td> 1196K
代理商: AM45DL3208GB70IS
52
Am45DL3208G
March 12, 2004
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
Sector/Sector Block Protect: 150 μs,
Sector/Sector Block Unprotect: 15 ms
1 μs
RESET#
SADD,
A6, A1, A0
Data
CE#f
WE#
OE#
60h
60h
40h
Valid*
Valid*
Valid*
Status
Sector/Sector Block Protect or Unprotect
Verify
V
ID
V
IH
* For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0, SADD = Sector Address.
Figure 27.
Sector/Sector Block Protect and
Unprotect Timing Diagram
相關(guān)PDF資料
PDF描述
AM45DL3208GB70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM45DL3208GB70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GB85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM