參數(shù)資料
型號: AM42BDS640AG
廠商: Spansion Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 63/72頁
文件大?。?/td> 1060K
代理商: AM42BDS640AG
November 1, 2002
Am42BDS640AG
65
P R E L I M INARY
SRAM AC CHARACTERISTICS
Write Cycle
Notes:
1. WE# controlled.
2. t
CW is measured from CE1#s going low to the end of write.
3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high.
4. t
AS is measured from the address valid to the beginning of write.
5. A write occurs during the overlap (t
WP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when
asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A
write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write
to the end of write.
Figure 36.
SRAM Write Cycle—WE# Control
Parameter
Symbol
Description
D8, D9
(54 MHz)
C8, C9
(40 MHz)
Unit
t
WC
Write Cycle Time
Min
70
85
ns
t
Cw
Chip Enable to End of Write
Min
60
70
ns
t
AS
Address Setup Time
Min
0
ns
t
AW
Address Valid to End of Write
Min
60
70
ns
t
BW
UB#s, LB#s to End of Write
Min
60
70
ns
t
WP
Write Pulse Time
Min
50
60
ns
t
WR
Write Recovery Time
Min
0
ns
t
WHZ
Write to Output High-Z
Min
0
ns
Max
20
t
DW
Data to Write Time Overlap
Min
30
ns
t
DH
Data Hold from Write Time
Min
0
ns
t
OW
End Write to Output Low-Z
min
5
ns
Address
CS1#s
UB#s, LB#s
WE#
Data In
Data Out
tWC
tCW
(See Note 2)
tAW
High-Z
Data Valid
CS2s
tCW
(See Note 2)
tBW
tWP
(See Note 5)
tAS
(See Note 4)
tWR (See Note 3)
tWHZ
tDW
tDH
tOW
(See Note 9)
(See Note 7)
(See Note 6)
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