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| 型號： | AM42BDS640AG |
| 廠商： | Spansion Inc. |
| 元件分類： | SRAM |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 57/72頁 |
| 文件大小： | 1060K |
| 代理商： | AM42BDS640AG |
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November 1, 2002
Am42BDS640AG
59
P R E L I M INARY
AC CHARACTERISTICS)
Notes:
1. RDY active with data (A18 = 0 in the Burst Mode Configuration Register).
2. RDY active one clock cycle before data (A18 = 1 in the Burst Mode Configuration Register).
3. Cxx indicates the clock that triggers Dxx on the outputs; for example, C60 triggers D60. Figure shows the device not crossing
a bank in the process of performing an erase or program.
Figure 30.
Latency with Boundary Crossing
CLK
Address (hex)
C60
C61
C62
C63
C64
C65
C66
C67
D60
D61
D62
D63
D64
D65
D66
D67
(stays high)
AVD#
RDY
Data
Address boundary occurs every 64 words, beginning at address
00003Fh (00007Fh, 0000BFh, etc.). Address 000000h is also a boundary crossing.
3C
3D
3E
3F
40
41
42
43
latency
RDY
latency
tRACC
(Note 1)
(Note 2)
tRACC
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| AM42BDS640AGBC8IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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| AM42BDS640AGBC9IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD8IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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