參數(shù)資料
型號： AM42BDS640AG
廠商： Spansion Inc.
元件分類： SRAM
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： 堆疊式多芯片封裝（MCP）閃存和SRAM
文件頁數(shù)： 52/72頁
文件大?。?/td> 1060K
代理商： AM42BDS640AG
November 1, 2002
Am42BDS640AG
55
P R E L I M INARY
AC CHARACTERISTICS
Figure 25.
Chip/Sector Erase Command Sequence
Notes:
1. SA is the sector address for Sector Erase.
2. Address bits A21–A12 are don’t cares during unlock cycles in the command sequence.
OE#
CE#f
Data
Addresses
AVD#
WE#
CLK
VCC
tAS
tWP
tAH
tWC
tWPH
SA
tVCS
tCS
tDH
tCH
In
Progress
tWHWH2
VA
Complete
VA
Erase Command Sequence (last two cycles)
Read Status Data
tDS
10h for
chip erase
555h for
chip erase
VIH
VIL
tAVDP
55h
2AAh
30h
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42BDS640AGBC8IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC8IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42BDS640AGBC9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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