參數(shù)資料
型號： ADV7850KBCZ-5
廠商： Analog Devices Inc
文件頁數(shù)： 5/32頁
文件大?。?/td> 0K
描述： IC VIDEO DECODER 3D 425CSPBGA
標準包裝： 1
類型： HDMI，接收器
應(yīng)用： HDTV，投影儀，機頂盒
安裝類型： 表面貼裝
封裝/外殼： 425-LFBGA，CSBGA
供應(yīng)商設(shè)備封裝： 425-CSPBGA（19x19）
包裝： 托盤
Data Sheet
ADV7850
Rev. 0 | Page 13 of 32
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to GND
2.2 V
VDD to GND
2.2 V
PVDD to GND
2.2 V
TX_AVDD to GND
2.2 V
TX_PVDD to GND
2.2 V
SAVDD to GND
2.2 V
SDVDD to GND
2.2 V
CVDD to GND
2.2 V
DVDDIO to GND
4.0 V
TVDD to GND
4.0 V
AC_AVDD to GND
4.0 V
Maximum Difference Across All 1.8 V
Supplies
0.3 V to +0.3 V
Maximum Difference Across All 3.3 V
Supplies
0.3 V to +0.3 V
Maximum Difference Between 3.3 V
Domain Supplies and 1.8 V Domain
Supplies
0.3 V to +2.2 V
Digital Inputs Voltage to GND
0.3 V to DVDDIO + 0.3 V
Digital Outputs Voltage to GND
0.3 V to DVDDIO + 0.3 V
5 V Tolerant Digital Inputs to GND1
5.5 V
Analog Inputs to GND
0.3V to AVDD + 0.3 V0.3V
to AC_AVDD + 0.3 V
XTALN and XTALP to GND
0.3 V to PVDD + 0.3 V
Maximum Junction Temperature (TJ MAX)
125°C
Storage Temperature Range
65°C to +150°C
Infrared Reflow Soldering (20 sec)
260°C
1 The following inputs are 3.3 V inputs but are 5 V tolerant: HS_IN1/TRI7,
HS_IN2/TRI5, VS_IN1/TRI8, VS_IN2/TRI6, DDCA_SCL, DDCA_SDA, DDCB_SCL,
DDCB_SDA, DDCC_SCL, DDCC_SDA, DDCD_SCL, DDCD_SDA, VGA_SCL,
VGA_SDA, TX_DDC_SCL, TX_DDC_SDA, RXA_5V, RXB_5V, RXC_5V, RXD_5V
and VGA_5V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7850, the
user is advised to turn off unused sections of the part.
Due to PCB metal variation, and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θJA value.
The maximum junction temperature (TJ MAX) of 125°C must not be
exceeded. The following equation calculates the junction tempera-
ture using the measured package surface temperature and applies
only when no heat sink is used on the device under test (DUT):
(
)
TOTAL
JT
S
J
W
Ψ
T
×
+
=
where:
TS is the package surface temperature (°C).
ΨJT = 0.7°C/W for the 425-ball CSP_BGA.
WTOTAL = (PVDD × IPVDD) + (0.4 × TVDD × ITVDD) +
(CVDD × ICVDD) + (AVDD × IAVDD) + (VDD × IVDD) +
(DVDDIO × IDVDDIO) + (TX_AVDD × ITX_AVDD) +
(TX_PVDD × ITX_PVDD) + (SAVDD × ISAVDD) + (SDVDD ×
ISDVDD) + (TX_VDD33 × ITX_VDD33) + (AC_AVDD × IAC_AVDD)
where 0.4 reflects the 40% of TVDD power that is dissipated on
the part itself.
ESD CAUTION
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