參數(shù)資料
型號(hào): ADSP-TS203SABP-050
廠商: ANALOG DEVICES INC
元件分類(lèi): 數(shù)字信號(hào)處理
英文描述: 500 MHz TigerSHARC Processor with 4 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
中文描述: 32-BIT, 125 MHz, OTHER DSP, PBGA576
封裝: 25 X 25 MM, MS-034, BGA-576
文件頁(yè)數(shù): 33/48頁(yè)
文件大?。?/td> 2017K
代理商: ADSP-TS203SABP-050
ADSP-TS203S
Rev. C
|
Page 39 of 48
|
December 2006
ENVIRONMENTAL CONDITIONS
The ADSP-TS203S processor is rated for performance under
TCASE environmental conditions specified in the Operating Con-
Thermal Characteristics
The ADSP-TS203S processor is packaged in a 25 mm
× 25 mm,
thermally enhanced ball grid array (BGA_ED). The
ADSP-TS203S processor is specified for a case temperature
(TCASE). To ensure that the TCASE data sheet specification is not
exceeded, a heat sink and/or an air flow source may be required.
Table 34 shows the thermal characteristics of the
25 mm × 25 mm BGA_ED package. All parameters are based on
a JESD51-9 four-layer 2s2p board. All data are based on 3 W
power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm
Package
Parameter
Condition
Typical
Unit
θJA1
1
θJA measured per JEDEC standard JESD51-6.
Airflow = 0 m/s
12.9
2
θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
mounted boards, use 17.0°C/W for 0 m/s.
°C/W
Airflow = 1 m/s
10.2
°C/W
Airflow = 2 m/s
9.0
°C/W
Airflow = 3 m/s
8.0
°C/W
θJB3
3
θJB measured per JEDEC standard JESD51-9.
—7.7
°C/W
θJC4
4
θJC measured by cold plate test method (no approved JEDEC standard).
—0.7
°C/W
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