參數(shù)資料
型號(hào): ADSP-BF518BSWZ-4F4
廠商: Analog Devices Inc
文件頁數(shù): 61/68頁
文件大?。?/td> 0K
描述: IC DSP 16/32B 400MHZ LP 176LQFP
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點(diǎn)
接口: 以太網(wǎng),I²C,PPI,RSI,SPI,SPORT,UART/USART
時(shí)鐘速率: 400MHz
非易失內(nèi)存: 閃存(4Mb)
芯片上RAM: 116kB
電壓 - 輸入/輸出: 1.8V,2.5V,3.3V
電壓 - 核心: 1.30V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 176-LQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 176-LQFP-EP(24x24)
包裝: 托盤
Rev. B
|
Page 64 of 68
|
January 2011
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
SURFACE-MOUNT DESIGN
Table 56 is provided as an aid to PCB design. For industry
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-168-1)
Dimensions shown in millimeters
0.80
BSC
10.40
BSC SQ
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
0.80
REF
0.70
REF
0.36
REF
A
B
C
D
E
F
G
9
10
8
11
12
7
5
642
31
BOTTOM VIEW
H
J
K
L
M
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.50
0.45
0.40
BALL DIAMETER
SEATING
PLANE
A1 BALL
CORNER
A1 BALL
CORNER
0.34 NOM
0.29 MIN
1.50
1.40
1.30
1.12
1.06
1.00
14 13
N
P
Table 56. BGA Data for Use with Surface-Mount Design
Package
Package Ball Attach Type
Package Solder Mask
Opening
Package Ball Pad Size
168-Ball CSP_BGA
Solder Mask Defined
0.35 mm diameter
0.48 mm diameter
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