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參數(shù)資料
| 型號(hào)： | AD5757ACPZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 5/44頁 |
| 文件大小： | 0K |
| 描述： | IC DAC 16BIT QUAD IOUT 64LFCSP |
| 標(biāo)準(zhǔn)包裝： | 750 |
| 設(shè)置時(shí)間： | 15µs |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 4 |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 64-LFCSP-VQ（9x9） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | * |
| 采樣率（每秒）： | * |
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Data Sheet
AD5757
Rev. D | Page 13 of 44
Pin No.
Mnemonic
Description
51
CHARTC
HART Input Connection for DAC Channel C.
54
I
OUT_D
Current Output Pin for DAC Channel D.
56
V
BOOST_D
Supply for Channel D Current Output Stage (see Figure 49). To use the dc-to-dc feature of the device, connect as
shown in Figure 56.
57
COMP
DCDC_D
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel D dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation
CC Supply Requirements—Slewing sections in the Device Features section for more
information).
58
IGATED
Optional Connection for External Pass Transistor. Should be left unconnected when using the dc-to-dc converter.
See the External PMOS Mode section for more information.
59
CHARTD
HART Input Connection for DAC Channel D.
61
REFIN
External Reference Voltage Input.
62
REFOUT
Internal Reference Voltage Output. It is recommended to place a 0.1 F capacitor between REFOUT and
REFGND.
REFOUT must be connected to REFIN to use the internal reference.
63
R
SET_D
An external, precision, low drift 15 k current setting resistor can be connected to this pin to improve the I
OUT_D
temperature drift performance. See the Device Features section.
64
R
SET_C
An external, precision, low drift 15 k current setting resistor can be connected to this pin to improve the I
OUT_C
temperature drift performance. See the Device Features section.
EPAD
Exposed Pad. This exposed pad should be connected to AGND, or, alternatively, it can be left electrically
unconnected. It is recommended that the pad be thermally connected to a copper plane for enhanced thermal
performance.
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