參數(shù)資料
型號: 21103
英文描述: AMD-K6 Processor Family Thermal Solutions Application Note AMD-K6 Processor Power Supply Design Application Note
中文描述: 的AMD - K6處理器系列散熱解決方案應(yīng)用指南的AMD - K6處理器電源設(shè)計應(yīng)用指南
文件頁數(shù): 31/64頁
文件大?。?/td> 1056K
代理商: 21103
Decoupling and Layout Recommendations
21
21103G/0—February 1999
AMD-K6
Processor Power Supply Design
desktop systems, the most likely use for this technique is in
portable systems.
Figure 10 on page 21 shows another way to reduce via
inductance— parallel vias. This technique is usually used on
bulk decoupling capacitors. The inductance contribution
numbers shown in Table 4 indicate that a poor layout can
negate a good component.
Figure 10. Via Layout For Low Inductance
Table 4.
Inductance Contributions of Components
Component
Capacitor
Via
100 mil Trace
Induction
Comment
0.6nH (approximately) ESL
0.7nH (approximately)
1.6nH (approximately) 10 mil wide trace
Capacitor
Pad
Dual Vias
No Trace between Via and Pad
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