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| 型號： | 21103 |
| 英文描述： | AMD-K6 Processor Family Thermal Solutions Application Note AMD-K6 Processor Power Supply Design Application Note |
| 中文描述： | 的AMD - K6處理器系列散熱解決方案應(yīng)用指南的AMD - K6處理器電源設(shè)計(jì)應(yīng)用指南 |
| 文件頁數(shù)： | 24/64頁 |
| 文件大?。?/td> | 1056K |
| 代理商： | 21103 |
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14
Decoupling and Layout Recommendations
AMD-K6
Processor Power Supply Design
21103G/0—February 1999
Example 4
Actual 2.2 V @ 7.5A
This example assumes a device with a maximum processor
current transient of 7.5A, the voltage tolerance of the processor
is less than 100mV, and the voltage regulator response time is
10
μ
s.
Using six tantalum capacitors with 60-m
ESR (the parallel
resistance is 10m
) as bulk capacitors, the minimum bulk
capacitance is:
C
O
≥
((7.5A/(0.100
V – [7.5A
10m
]
)) 10
μ
s = 3000
μ
F
Six 470-
μ
F tantalum capacitors with 55-m
ESR meet this
requirement. However, if the brand of capacitor is changed to
one with a 100-m
ESR, the supply is out of tolerance.
Therefore, when designing a system that supports only 2.2V
devices, the required bulk decoupling is significantly less than
the bulk decoupling for the higher voltage and higher current
parts. Note that the voltage tolerance is an important factor.
Because of the higher Vcc2 tolerance in example 3 the
decoupling requirement is slightly less than the 2.2V case.
Note:
The denominator of the C
0
equation cannot be a negative
value, which implies a negative capacitor (such as a
battery).
In order to achieve greater margin, the total error budget
should be distributed between set point tolerance, ESL, and
ESR as shown in Figure 6 and Table 1 on page 15. Although the
drop from ESL is a small factor, it is not negligible. If aluminum
electrolytic capacitors are used instead of tantulum capacitors,
the ESL drop is larger.
The high-frequency decoupling capacitors (C
F
), which are
typically smaller in capacitance and ESL, maintain the voltage
output during average load change until C
B
can react. See
“High-Frequency Decoupling” on page 23 for more
information.
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