- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄9990 > XRT75R12DIB (Exar Corporation)IC LIU E3/DS3/STS-1 12CH 420TBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | XRT75R12DIB |
| 廠商： | Exar Corporation |
| 文件頁(yè)數(shù)： | 32/133頁(yè) |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 12CH 420TBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 類型： | 線路接口裝置（LIU） |
| 驅(qū)動(dòng)器/接收器數(shù)： | 12/12 |
| 規(guī)程： | DS3，E3，STS-1 |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 420-LBGA 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 420-TBGA（35x35） |
| 包裝： | 托盤 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)當(dāng)前第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)
XRT75R12D
123
REV. 1.0.3
TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
output a DS3 line signal (to the DS3 facility) that complies with the "Category I Intrinsic Jitter Requirements -
per Telcordia GR-253-CORE (for DS3 applications). This scheme is illustrated below in Figure 71.
8.8.3
How does the LIU permit the user to comply with the SONET APS Recovery Time
requirements of 50ms (per Telcordia GR-253-CORE)?
Telcordia GR-253-CORE, Section 5.3.3.3 mandates that the "APS Completion" (or Recovery) time be 50ms or
less. Many of our customers interpret this particular requirement as follows.
"From the instant that an APS is initiated on a high-speed SONET signal, all lower-speed SONET traffic (which
is being transported via this "high-speed" SONET signal) must be fully restored within 50ms. Similarly, if the
"high-speed" SONET signal is transporting some PDH signals (such as DS1 or DS3, etc.), then those entities
that are responsible for acquiring and maintaining DS1 or DS3 frame synchronization (with these DS1 or DS3
data-streams that have been de-mapped from SONET) must have re-acquired DS1 or DS3 frame
synchronization within 50ms" after APS has been initiated."
The LIU was designed such that the DS3 signals that it receives from a SONET Mapper device and processes
will comply with the Category I Intrinsic Jitter requirements per Telcordia GR-253-CORE.
Reference 1 documents some APS Recovery Time testing, which was performed to verify that the Jitter
Attenuator blocks (within the LIU) device that permit it to comply with the Category I Intrinsic Jitter
Requirements (for DS3 Applications) per Telcordia GR-253-CORE, do not cause it to fail to comply with the
"APS Completion Time" requirements per Section 5.3.3.3 of Telcordia GR-253-CORE. However, Table 50
presents a summary of some APS Recovery Time requirements that were documented within this test report.
FIGURE 71. SIMPLE ILLUSTRATION OF THE LIU BEING USED IN A SONET DE-SYNCHRONIZER" APPLICATION
TABLE 50: MEASURED APS RECOVERY TIME AS A FUNCTION OF DS3 PPM OFFSET
DS3 PPM OFFSET (PER W&G ANT-20SE)
MEASURED APS RECOVERY TIME (PER LOGIC ANALYZER)
-99 ppm
1.25ms
-40ppm
1.54ms
-30 ppm
1.34ms
-20 ppm
1.49ms
-10 ppm
1.30ms
DS3 to STS-N
Mapper/
Demapper
IC
DS3 to STS-N
Mapper/
Demapper
IC
LIU
STS-N Signal
TPDATA_n input pin
TCLK_n input
De-Mapped (Gapped)
DS3 Data and Clock
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XRT75R12IB | IC LIU E3/DS3/STS-1 12CH 420TBGA |
| ISL267450AIUZ-T | IC INTERFACE |
| MS3116P16-8P | CONN PLUG 8POS STRAIGHT W/PINS |
| IDT72V815L15PFI | IC FIFO SYNC 512X18 15NS 128QFP |
| MS27513E8F35SD | CONN RCPT 6POS BOX MNT W/SCKT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XRT75R12DIB-F | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 12 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| XRT75R12DIB-L | 功能描述:LIN 收發(fā)器 Synch RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8 |
| XRT75R12ES | 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 12CH T3/E3/STS1LIUJA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel |
| XRT75R12IB | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 12CH E3/DS3/STS W/JITTER R3 TECH RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| XRT75R12IB-F | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 12 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。