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參數(shù)資料
| 型號(hào)： | XPC850 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁(yè)數(shù)： | 2/15頁(yè) |
| 文件大?。?/td> | 133K |
| 代理商： | XPC850 |
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1.0 Purpose and Description
This report summarizes the reliability data for Motorola communication
microprocessors fabricated on the 0.42
m
single polysilicon process in our wafer
fabrication facility, Mos 11, in Austin, Texas. The current devices fabricated using this
process are given in the table below.
Device
Mask Set
Design
Revision
0.3
Die Size
(mils)
309 x 335
Process
Geometry
0.42
m
0.42
m
XPC850
F98S
XPC860
J24A
H96G
J21M
B.1
C
0.2
338 x 329
338 x 329
338 x 347
XPC860T
0.42
m
Table 1. Device properties.
All of these devices are currently in their XC phase of product life, which is the
time when design errata are discovered and corrected. Although the 850 and 860 are still
classified as XC devices, they are built using production equipment and processes, and
have completed their reliability qualifications. There are some functional errata on these
devices, which may impact some customers. These errata are expected to be corrected in
revision D of the 860, which we expect to grant MC status to. For a list of current design
errata on these devices, please contact your local Motorola sales person. To locate the
nearest sales office, you can find them on our website at http://mot-sps.com/sales/
sales_web.html
2.0 Assembly / Package Information
The XPC850 is assembled in a 256 leaded plastic ball grid array. The XPC860 is
assembled in a 357 lead plastic ball grid array (PBGA). Both packages have been shown
to meet level 3 moisture sensitivity as classified by JEDEC A113. Our volume
production is manufactured in Motorolas Kuala Lumpur, Malaysia facility, however we
have also qualified Citizen Watch Co, in Japan as an alternate assembly site.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XPC860 | 32-Bit Microprocessor(32位微處理器) |
| XPC862 | Hardware Specifications |
| XPD0250CT-001-D1PFAB | 2.5 Gbps PIN-TIA module |
| XPD0250CT-001-B1MFAN | 2.5 Gbps PIN-TIA module |
| XPD0250CT-001-B1MFPB | 2.5 Gbps PIN-TIA module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XPC850CVR50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤(pán) |
| XPC850CVR50BUR2 | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤(pán) |
| XPC850CVR66BU | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤(pán) |
| XPC850CZT50B | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
| XPC850CZT50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類(lèi)型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類(lèi)型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤(pán) |
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