- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375041 > XPC850 (Motorola, Inc.) 32-Bit Microprocessor(32位微處理器) PDF資料下載
參數(shù)資料
| 型號(hào)： | XPC850 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁數(shù)： | 12/15頁 |
| 文件大?。?/td> | 133K |
| 代理商： | XPC850 |
12
5.0 Qualification Stress Descriptions
The following summary briefly describes the various reliability tests included in the
Motorola reliability monitor program.
DYNAMIC EARLY FAIL STUDY (EFR)
This stress is performed to accelerate infant mortality failure mechanisms, which are
defects that occur within the first year of normal device operation. The typical stress
condition is a temperature of 125
°
C, a voltage of 6V for 5V products and 4.5V for 3.3V
products, and a duration of 168 hours. Devices used in this test are sampled directly after
the standard production final test flow with no prescreening, unless called out in the
normal production flow.
HIGH TEMPERATURE OPERATING LIFE (HTOL) TEST
High Temperature Operating Life (HTOL) test is performed to accelerate failure
mechanism which are thermally activated through the application of extreme temperatures
and the use of dynamic operating conditions. All devices performing the HTOL test are
sampled directly after final electrical test with no prior burn-in or other pre-screening.
Testing is performed per Mil Std 883, Method 1005, with dynamic signaling applied to
the devices for a minimum duration of 168 hours. Some sample groups are extended to
2016 hours.
A device will be considered to have failed the life test if parametric limits are exceeded or
if functionality cannot be demonstrated under nominal and worst case conditions
specified in the data sheet. Forms of mechanical damage, such as cracking of the package,
will be considered as a reject. Device which recovers after baking will also be considered
as a reject. Verified ESD and EOS failures shall not be considered legitimate nor will
failures caused by handling, such as bent leads or cosmetic package defects.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XPC860 | 32-Bit Microprocessor(32位微處理器) |
| XPC862 | Hardware Specifications |
| XPD0250CT-001-D1PFAB | 2.5 Gbps PIN-TIA module |
| XPD0250CT-001-B1MFAN | 2.5 Gbps PIN-TIA module |
| XPD0250CT-001-B1MFPB | 2.5 Gbps PIN-TIA module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XPC850CVR50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| XPC850CVR50BUR2 | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| XPC850CVR66BU | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| XPC850CZT50B | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
| XPC850CZT50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。