參數(shù)資料
型號(hào): XIO2200AZGW
廠商: Texas Instruments
文件頁(yè)數(shù): 146/202頁(yè)
文件大?。?/td> 0K
描述: IC PCI-EXPRESS/BUS BRIDGE 176BGA
產(chǎn)品培訓(xùn)模塊: PCI Express Basics
標(biāo)準(zhǔn)包裝: 126
應(yīng)用: PCI Express 至 PCI 轉(zhuǎn)換橋
接口: PCI
電源電壓: 1.35 V ~ 1.65 V,3 V ~ 3.6 V
封裝/外殼: 176-LFBGA
供應(yīng)商設(shè)備封裝: 176-BGA MICROSTAR(15x15)
包裝: 托盤
安裝類型: 表面貼裝
產(chǎn)品目錄頁(yè)面: 882 (CN2011-ZH PDF)
配用: XIO2200AEVM-ND - XIO2200AEVM
其它名稱: 296-19567
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)當(dāng)前第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)
Feature/Protocol Descriptions
35
March 5 2007 June 2011
SCPS154C
3.9
General-Purpose I/O Interface
Up to eight general-purpose input/output (GPIO) terminals are provided for system customization. These
GPIO terminals are 3.3-V tolerant.
The exact number of GPIO terminals varies based on implementing the clock run, power override, and serial
EEPROM interface features. These features share four of the eight GPIO terminals. When any of the three
shared functions are enabled, the associated GPIO terminal is disabled.
All eight GPIO terminals are individually configurable as either inputs or outputs by writing the corresponding
bit in the GPIO control register at offset B4h. A GPIO data register at offset B6h exists to either read the logic
state of each GPIO input or to set the logic state of each GPIO output. The power-up default state for the GPIO
control register is input mode.
3.10 Set Slot Power Limit Functionality
The PCI Express Specification provides a method for devices to limit internal functionality and save power
based on the value programmed into the captured slot power limit scale (CSPLS) and capture slot power limit
value (CSPLV) fields of the PCI Express device capabilities register at offset 94h. See Section 4.49, Device
Capabilities Register, for details. The bridge writes these fields when a set slot power limit message is received
on the PCI Express interface.
After the deassertion of PERST, the XIO2200A compares the information within the CSPLS and CSPLV fields
of the device capabilities register to the minimum power scale (MIN_POWER_SCALE) and minimum power
value (MIN_POWER_VALUE) fields in the general control register at offset D4h. See Section 4.65, General
Control Register, for details. If the CSPLS and CSPLV fields are less than the MIN_POWER_SCALE and
MIN_POWER_VALUE fields, respectively, then the bridge takes the appropriate action that is defined below.
The power usage action is programmable within the bridge. The general control register includes a 3-bit
PWR_OVRD field. This field is programmable to the following two options:
1. Ignore slot power limit fields
2. Respond with unsupported request to all transactions except type 0/1 configuration transactions and set
slot power limit messages
3.11 PCI Express and PCI Bus Power Management
The bridge supports both software-directed power management and active state power management through
standard PCI configuration space. Software-directed registers are located in the power management
capabilities structure located at offset 50h. Active state power management control registers are located in
the PCI Express capabilities structure located at offset 90h.
During software-directed power management state changes, the bridge initiates link state transitions to L1 or
L2/L3 after a configuration write transaction places the device in a low power state. The power management
state machine is also responsible for gating internal clocks based on the power state. Table 312 identifies
the relationship between the D-states and bridge clock operation.
Table 312. Clocking In Low Power States
CLOCK SOURCE
D0/L0
D1/L1
D2/L1
D3/L2/L3
PCI express reference clock input (REFCLK)
On
On/Off
Internal PCI bus clock to bridge function
On
Off
Internal PCI bus clock to 1394a OHCI function
On
On/Off
The link power management (LPM) state machine manages active state power by monitoring the PCI Express
transaction activity. If no transactions are pending and the transmitter has been idle for at least the minimum
time required by the PCI Express Specification, then the LPM state machine transitions the link to either the
L0s or L1 state. By reading the bridge’s L0s and L1 exit latency in the link capabilities register, the system
software may make an informed decision relating to system performance versus power savings. The ASLPMC
field in the link control register provides an L0s only option, L1 only option, or both L0s and L1 option.
Not Recommended for New Designs
相關(guān)PDF資料
PDF描述
XPC823ZT81B2T IC MPU POWERQUICC 81MHZ 256-PBGA
XPC8240RZU250E MCU HOST PROCESSOR 352-TBGA
XQ6SLX150T-3CSG484I IC FPGA SPARTAN-6Q 484-CSBGA
XR16C2550IJ-F IC UART FIFO 16B DUAL 44PLCC
XR16C2850IM-F IC UART FIFO 128B DUAL 48TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XIO2200AZGW 制造商:Texas Instruments 功能描述:PCI Express to PCI Bus Converter IC
XIO2200AZHH 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PCI Exp-PCI Bus Trans Bridge RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XIO2200GGW 功能描述:IC PCI-EXPRESS/BUS BRIDGE 176BGA RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA,便攜式音頻/視頻,智能電話 接口:I²C,2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤(4x4) 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
XIO2200ZGW 功能描述:IC PCI-EXPRESS/BUS BRIDGE 176BGA RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA,便攜式音頻/視頻,智能電話 接口:I²C,2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤(4x4) 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
XIO2213A 制造商:TI 制造商全稱:Texas Instruments 功能描述:XIO2213A PCI Express to 1394b OHCI with 3-Port PHY