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參數(shù)資料
| 型號(hào)： | XIO2200AZGW |
| 廠商： | Texas Instruments |
| 文件頁(yè)數(shù)： | 111/202頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC PCI-EXPRESS/BUS BRIDGE 176BGA |
| 產(chǎn)品培訓(xùn)模塊： | PCI Express Basics |
| 標(biāo)準(zhǔn)包裝： | 126 |
| 應(yīng)用： | PCI Express 至 PCI 轉(zhuǎn)換橋 |
| 接口： | PCI |
| 電源電壓： | 1.35 V ~ 1.65 V，3 V ~ 3.6 V |
| 封裝/外殼： | 176-LFBGA |
| 供應(yīng)商設(shè)備封裝： | 176-BGA MICROSTAR（15x15） |
| 包裝： | 托盤 |
| 安裝類型： | 表面貼裝 |
| 產(chǎn)品目錄頁(yè)面： | 882 (CN2011-ZH PDF) |
| 配用： | XIO2200AEVM-ND - XIO2200AEVM |
| 其它名稱： | 296-19567 |
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
XIO2200AZGW
NRND
BGA
MICROSTAR
ZGW
176
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
XIO2200A
XIO2200AZHH
NRND
BGA
MICROSTAR
ZHH
175
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
XIO2200A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XIO2200AZGW | 制造商:Texas Instruments 功能描述:PCI Express to PCI Bus Converter IC |
| XIO2200AZHH | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PCI Exp-PCI Bus Trans Bridge RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| XIO2200GGW | 功能描述:IC PCI-EXPRESS/BUS BRIDGE 176BGA RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2 |
| XIO2200ZGW | 功能描述:IC PCI-EXPRESS/BUS BRIDGE 176BGA RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2 |
| XIO2213A | 制造商:TI 制造商全稱:Texas Instruments 功能描述:XIO2213A PCI Express to 1394b OHCI with 3-Port PHY |
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