參數(shù)資料
型號： XC3S700AN-4FG484I
廠商： Xilinx Inc
文件頁數(shù)： 43/123頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN 3AN 484FBGA
標(biāo)準(zhǔn)包裝： 60
系列： Spartan®-3AN
LAB/CLB數(shù)： 1472
邏輯元件/單元數(shù)： 13248
RAM 位總計： 368640
輸入/輸出數(shù)： 372
門數(shù)： 700000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 484-BBGA
供應(yīng)商設(shè)備封裝： 484-FBGA
Spartan-3AN FPGA Family: DC and Switching Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
26
Pin-to-Pin Setup and Hold Times
Table 22: Pin-to-Pin Setup and Hold Times for the IOB Input Path (System Synchronous)
Symbol
Description
Conditions
Device
Speed Grade
Units
-5
-4
Min
Setup Times
TPSDCM
When writing to the Input
Flip-Flop (IFF), the time from the
setup of data at the Input pin to
the active transition at a Global
Clock pin. The DCM is in use. No
Input Delay is programmed.
LVCMOS25(2),
IFD_DELAY_VALUE = 0,
with DCM(4)
XC3S50AN
2.45
2.68
ns
XC3S200AN
2.59
2.84
ns
XC3S400AN
2.38
2.68
ns
XC3S700AN
2.38
2.57
ns
XC3S1400AN
1.91
2.17
ns
TPSFD
When writing to IFF, the time from
the setup of data at the Input pin
to an active transition at the
Global Clock pin. The DCM is not
in use. The Input Delay is
programmed.
LVCMOS25(2),
IFD_DELAY_VALUE = 5,
without DCM
XC3S50AN
2.55
2.76
ns
XC3S200AN
2.32
2.76
ns
XC3S400AN
2.21
2.60
ns
XC3S700AN
2.28
2.63
ns
XC3S1400AN
2.33
2.41
ns
Hold Times
TPHDCM
When writing to IFF, the time from
the active transition at the Global
Clock pin to the point when data
must be held at the Input pin. The
DCM is in use. No Input Delay is
programmed.
LVCMOS25(3),
IFD_DELAY_VALUE = 0,
with DCM(4)
XC3S50AN
–0.36
ns
XC3S200AN
–0.52
ns
XC3S400AN
–0.33
–0.29
ns
XC3S700AN
–0.17
–0.12
ns
XC3S1400AN
–0.07
0.00
ns
TPHFD
When writing to IFF, the time from
the active transition at the Global
Clock pin to the point when data
must be held at the Input pin. The
DCM is not in use. The Input
Delay is programmed.
LVCMOS25(3),
IFD_DELAY_VALUE = 5,
without DCM
XC3S50AN
–0.63
–0.58
ns
XC3S200AN
–0.56
ns
XC3S400AN
–0.42
ns
XC3S700AN
–0.80
–0.75
ns
XC3S1400AN
–0.69
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 30 and are based on the operating conditions set forth in
2.
This setup time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data
Input. If this is true of the Global Clock Input, subtract the appropriate adjustment from Table 26. If this is true of the data Input, add the
appropriate Input adjustment from the same table.
3.
This hold time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data
Input. If this is true of the Global Clock Input, add the appropriate Input adjustment from Table 26. If this is true of the data Input, subtract the
appropriate Input adjustment from the same table. When the hold time is negative, it is possible to change the data before the clock’s active
edge.
4.
DCM output jitter is included in all measurements.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S700AN-4FGG484C 功能描述:IC SPARTAN-3AN FPGA 700K 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
XC3S700AN-4FGG484CES 制造商:Xilinx 功能描述:
XC3S700AN-4FGG484I 功能描述:IC FPGA SPARTAN -3AN700K 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
XC3S700AN-5FG484C 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 372 I/O 484FBGA
XC3S700AN-5FGG484C 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3AN 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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