參數(shù)資料
型號： XC2S100E-6TQG144C
廠商： Xilinx Inc
文件頁數(shù)： 60/108頁
文件大?。?/td> 0K
描述： IC FPGA 1.8V 600 CLB'S 144-TQFP
產品變化通告： FPGA Family Discontinuation 18/Apr/2011
標準包裝： 60
系列： Spartan®-IIE
LAB/CLB數(shù)： 600
邏輯元件/單元數(shù)： 2700
RAM 位總計： 40960
輸入/輸出數(shù)： 102
門數(shù)： 100000
電源電壓： 1.71 V ~ 1.89 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 144-LQFP
供應商設備封裝： 144-TQFP（20x20）
其它名稱： 122-1462
DS077-4 (v3.0) August 9, 2013
55
Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Spartan-IIE Package Pinouts
The Spartan-IIE family of FPGAs is available in five popu-
lar, low-cost packages, including plastic quad flat packs and
fine-pitch ball grid arrays. Family members have footprint
compatibility across devices provided in the same package,
with minor exceptions due to the smaller number of I/O in
smaller devices or due to LVDS/LVPECL pin pairing. The
Spartan-IIE family is not footprint compatible with any other
FPGA family. The following package-specific pinout tables
indicate function, pin, and bank information for all devices
available in that package. The pinouts follow the pad loca-
tions around the die, starting from pin 1 on the QFP pack-
ages.
Package Overview
Table 12 shows the five low-cost, space-saving production
package styles for the Spartan-IIE family.
Each package style is available in an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For
example, the standard “TQ144” package becomes
“TQG144” when ordered as the Pb-free option. Leaded
(non-Pb-free) packages may be available for selected
devices, with the same pin-out and without the "G" in the
ordering code; contact Xilinx sales for more information.
The mechanical dimensions of the standard and Pb-free
packages are similar, as shown in the mechanical drawings
provided in Table 13.
For additional package information, see UG112: Device
Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx web site at the specified location in
Material Declaration Data Sheets (MDDS) are also
available on the Xilinx web site for each package.
Table 12: Spartan-IIE Family Package Options
Package
Leads
Type
Maximum
I/O
Lead Pitch
(mm)
Footprint
Area (mm)
Height
(mm)
Mass(1)
(g)
TQ144 / TQG144
144
Thin Quad Flat Pack (TQFP)
102
0.5
22 x 22
1.60
1.4
PQ208 / PQG208
208
Plastic Quad Flat Pack (PQFP)
146
0.5
30.6 x 30.6
3.70
5.3
FT256 / FTG256
256
Fine-pitch Thin Ball Grid Array (FBGA)
182
1.0
17 x 17
1.55
1.0
FG456 / FGG456
456
Fine-pitch Ball Grid Array (FBGA)
329
1.0
23 x 23
2.60
2.2
FG676 / FGG676
676
Fine-pitch Ball Grid Array (FBGA)
514
1.0
27 x 27
2.60
3.1
Notes:
1.
Package mass is
±10%.
Table 13: Xilinx Package Documentation
Package
Drawing
MDDS
TQ144
TQG144
PQ208
PQG208
FT256
FTG256
FG456
FGG456
FG676
FGG676
相關PDF資料
PDF描述
XC2S100E-6TQ144C IC FPGA 1.8V 600 CLB'S 144-TQFP
XA3S200-4PQG208I IC FPGA SPARTAN-3 200K 208-PQFP
24FC64FT-I/SN IC EEPROM 64KBIT 1MHZ 8SOIC
XA2S50E-6TQ144Q IC FPGA SPARTAN-IIE 144TQFP
RSA50DTBD-S664 CONN EDGECARD 100PS R/A .125 SLD
相關代理商/技術參數(shù)
參數(shù)描述
XC2S100E-6TQG144I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E7FG456C 制造商:Xilinx 功能描述:
XC2S100E-7FG456C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE 1.8V FPGA Family
XC2S100E-7FG456I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE 1.8V FPGA Family
XC2S100E-7FG676C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*