
14
FN8149.0
January 13, 2005
Functional Description
Hot Circuit Insertion
When circuit boards are inserted into a live backplane, the
bypass capacitors at the input of the board’s power module
or DC/DC converter can draw huge transient currents as
they charge up (See Figure 30). This transient current can
cause permanent damage to the board’s components and
cause transients on the system power supply.
The X80010 is designed to turn on a board’s supply voltage
in a controlled manner (see Figure 31), allowing the board to
be safely inserted or removed from a live backplane. The
device also provides undervoltage, overvoltage and
overcurrent protection while keeping the power module
(DC/DC converter) off until the backplane input voltage is
stable and within tolerance.
Overvoltage and Undervoltage Shutdown
The X80010 provides overvoltage and undervoltage
protection circuits. When an overvoltage (V
OV
) or
undervoltage (V
UV1
and V
UV2
) condition is detected, the
GATE pin immediately pulls low. The undervoltage threshold
V
UV1
applies to the normal operation with a mains supply.
The undervoltage threshold V
UV2
assumes the system is
powered by a battery. When using a battery backup, the
21
RESET
RESET Output.
This open drain pin is an active LOW output. This pin will be active until PWRGD goes active and the power
sequencing is complete. This pin will be released after a programmable delay.
22
NA1
Not Available.
Do not connect to this pin.
23
MRC
Manual Reset Input Cold-side.
Pulling the MRC pin HIGH initiates a system side RESET. The MRC signal must be held HIGH
for 5
μ
s. It has an internal pulldown resistor. (>10m
typical)
24
NC
No Connect.
No internal connections.
25
V
EE
NC
Negative Supply Voltage Input.
26
No Connect.
No internal connections.
27
FAR
Failure After Re-try (FAR)
output signal. Failure After Re-try (FAR) is asserted after a number of retries. Used for Overcurrent
and hardshort detection.
28
BATT-ON
Battery On Input
. This input signals that the battery backup (or secondary supply) is supplying power to the backplane. It has
an internal pulldown resistor. (>10m
typical)
29
PWRGD
Power Good Output.
This output pin enables a power module.
30
IGQ1
Gate Current Quick Select Bit 1 Input.
This pin is used to change the gate current drive and is intended to allow for current
ramp rate control of the gate pin of an external FET. It has an internal pulldown resistor. (>10m
typical)
31
IGQ0
Gate Current Quick Select Bit 0 Input.
This pin is used to change the gate current drive and is intended to allow for current
ramp rate control of the gate pin of an external FET. It has an internal pulldown resistor. (>10m
typical)
32
MRH
Manual Reset Input Hot-side.
Pulling the MRH pin LOW initiates a GATE pin reset (GATE pin pulled LOW). The MRH signal
must be held LOW for 5
μ
s (minimum).
Pin Descriptions
(Continued)
PIN
NAME
DESCRIPTION
V
DD
X80010
X80011
X80012
X80013
V
UV/OV
OV=71V
V
EE
SENSE
DRAIN
-48V
Return
UV=37V
-48V
GATE
Rs
0.02
5%
R4
182K
1%
R5
30k
1%
R6
10K
1%
Q1IRFR120
100K
-48V
DC/DC
Converter
DC/DC
Converter
I
inrush
0.1μF
100
4.7k
3.3n
FIGURE 30. TYPICAL -48V HOTSWAP APPLICATION CIRCUIT
FIGURE 31. TYPICAL INRUSH WITH GATE SLEW RATE
CONTROL
X80010, X80011, X80012, X80013