參數(shù)資料
型號： W971GG6IB-25
廠商： WINBOND ELECTRONICS CORP
元件分類： DRAM
英文描述： 32M X 16 DDR DRAM, 0.4 ns, PBGA84
封裝： 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84
文件頁數(shù)： 13/86頁
文件大?。?/td> 1360K
代理商： W971GG6IB-25
W971GG6IB
Publication Release Date: Oct. 23, 2009
- 20 -
Revision A02
7.3 Command Function
7.3.1
Bank Activate Command
( CS ="L", RAS ="L", CAS ="H", WE ="H", BA0, BA1, BA2=Bank, A0 to A12 be row address)
The Bank Activate command must be applied before any Read or Write operation can be executed.
Immediately after the bank active command, the DDR2 SDRAM can accept a read or write command
on the following clock cycle. If a Read/Write command is issued to a bank that has not satisfied the
tRCDmin specification, then additive latency must be programmed into the device to delay when the
Read/Write command is internally issued to the device. The additive latency value must be chosen to
assure tRCDmin is satisfied. Additive latencies of 0, 1, 2, 3, 4, 5 and 6 are supported. Once a bank has
been activated it must be precharged before another Bank Activate command can be applied to the
same bank. The bank active and precharge times are defined as tRAS and tRP, respectively. The
minimum time interval between successive Bank Activate commands to the same bank is determined
by the RAS cycle time of the device (tRC). The minimum time interval between Bank Activate
commands is tRRD.
In order to ensure that components with 8 internal memory banks do not exceed the instantaneous
current supplying capability, certain restrictions on operation of the 8 banks must be observed. There
are two rules. One for restricting the number of sequential ACT commands that can be issued and
another for allowing more time for RAS precharge for a Precharge All command. The rules are as
follows:
Sequential Bank Activation Restriction: No more than 4 banks may be activated in a rolling tFAW
window. Converting to clocks is done by dividing tFAW[nS] by tCK(avg)[ns], and rounding up to
next integer value. As an example of the rolling window, if RU{ (tFAW / tCK(avg) } is 10 clocks,
and an activate command is issued in clock N, no more than three further activate commands
may be issued at or between clock N+1 and N+9.
Precharge All Allowance: tRP for a Precharge All command is equal to tnRP + 1 x nCK, where
tnRP = RU{ tRP / tCK(avg) } and tRP is the value for a single bank precharge.
Figure 12—Bank activate command cycle: tRCD = 3, AL = 2, tRP = 3, tRRD = 2, tCCD = 2
相關(guān)PDF資料
PDF描述
W9751G6JB-25A 32M X 16 DDR DRAM, 0.4 ns, PBGA84
W9751G8JB-18 DDR DRAM, PBGA84
W9812G21H-6I 4M X 32 SYNCHRONOUS DRAM, 5 ns, PDSO86
W9812G21H-6C 4M X 32 SYNCHRONOUS DRAM, 4.5 ns, PDSO86
W9812G6JH-6 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W971GG6JB 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M ? 8 BANKS ? 16 BIT DDR2 SDRAM
W971GG6JB-18 制造商:Winbond Electronics Corp 功能描述:1GB DDR2 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 1GBIT 1.875NS
W971GG6JB-25 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:64MBX16 DDR2 制造商:Winbond 功能描述:DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA
W971GG6JB25I 功能描述:IC DDR2 SDRAM 1GBIT 84WBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:32K (4K x 8) 速度:100kHz，400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) 其它名稱:CAV24C32WE-GT3OSTR
W971GG6JB-25I 制造商:Winbond Electronics 功能描述:-40~85 1GB DDR2 FOR INDUSTRY
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