參數(shù)資料
型號(hào): W25X80ALDAIZ
廠商: WINBOND ELECTRONICS CORP
元件分類(lèi): PROM
英文描述: 1M X 8 FLASH 2.7V PROM, PDIP8
封裝: 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
文件頁(yè)數(shù): 32/45頁(yè)
文件大?。?/td> 1342K
代理商: W25X80ALDAIZ
W25X10AL, W25X20AL, W25X40AL, W25X80AL
- 38 -
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
L
O
c
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E
H
E
1
8
5
4
MILLIMETERS
INCHES
SYMBOL
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
b
0.33
0.51
0.013
0.020
c
0.19
0.25
0.008
0.010
E(3)
3.80
4.00
0.150
0.157
D(3)
4.80
5.00
0.188
0.196
e(2)
1.27 BSC
0.050 BSC
HE
5.80
6.20
0.228
0.244
Y(4)
-
0.10
-
0.004
L
0.40
1.27
0.016
0.050
10°
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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