參數(shù)資料
型號: W25X40AVSSIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 512K X 8 FLASH 2.7V PROM, PDSO8
封裝: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù): 37/45頁
文件大?。?/td> 1344K
代理商: W25X40AVSSIG
W25X10A, W25X20A, W25X40A, W25X80A
- 42 -
8-Pad WSON 6x5mm Cont’d.
MILLIMETERS
INCHES
SYMBOL
MIN
.
TYP.
MAX
MIN
TYP
MAX
SOLDER PATTERN
M
3.40
0. 38
13
N
4.30
0. 92
16
P
6.00
0. 60
23
Q
0.50
0. 96
01
R
0.75
0. 55
02
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad
相關(guān)PDF資料
PDF描述
W25X80AVDAIZ 1M X 8 FLASH 2.7V PROM, PDIP8
W25X80ALSSIG 1M X 8 FLASH 2.7V PROM, PDSO8
W25X40ALDAIZ 512K X 8 FLASH 2.7V PROM, PDIP8
W25X10ALSNIG 128K X 8 FLASH 2.7V PROM, PDSO8
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