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參數(shù)資料
| 型號(hào)： | W25X40AVSSIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 512K X 8 FLASH 2.7V PROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁(yè)數(shù)： | 22/45頁(yè) |
| 文件大?。?/td> | 1344K |
| 代理商： | W25X40AVSSIG |
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W25X10A, W25X20A, W25X40A, W25X80A
Publication Release Date: August 7, 2009
- 29 -
Revision F
10.2.16 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down/
Device ID instruction that provides both JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 18. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A
are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to
000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer
and Device IDs can be read continuously, alternating from one to the other. The instruction is
completed by driving /CS high.
Figure 18. Read Manufacturer / Device ID Diagram
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W25X80AVDAIZ | 1M X 8 FLASH 2.7V PROM, PDIP8 |
| W25X80ALSSIG | 1M X 8 FLASH 2.7V PROM, PDSO8 |
| W25X40ALDAIZ | 512K X 8 FLASH 2.7V PROM, PDIP8 |
| W25X10ALSNIG | 128K X 8 FLASH 2.7V PROM, PDSO8 |
| W27C257P-12 | 32K X 8 EEPROM 12V, 120 ns, PQCC32 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25X40AVZPIG | 功能描述:IC FLASH 16MBIT 100MHZ 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 同步，DDR II 存儲(chǔ)容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| W25X40BL | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |
| W25X40BLDAIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |
| W25X40BLSNIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |
| W25X40BLSSIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |
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