參數(shù)資料
型號: W25Q16CVDAAG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDIP8
封裝: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件頁數(shù): 69/79頁
文件大?。?/td> 1131K
代理商: W25Q16CVDAAG
W25Q16CV
Publication Release Date: April 01, 2011
- 71 -
Revision C
9.2 8-Pin SOIC 208-mil (Package Code SS)
θ
GAUGE PLANE
θ
GAUGE PLANE
SYMBOL
MILLIMETERS
INCHES
Min
Nom
Max
Min
Nom
Max
A
1.75
1.95
2.16
0.069
0.077
0.085
A1
0.05
0.15
0.25
0.002
0.006
0.010
A2
1.70
1.80
1.91
0.067
0.071
0.075
b
0.35
0.42
0.48
0.014
0.017
0.019
C
0.19
0.20
0.25
0.007
0.008
0.010
D
5.18
5.28
5.38
0.204
0.208
0.212
D1
5.13
5.23
5.33
0.202
0.206
0.210
E
5.18
5.28
5.38
0.204
0.208
0.212
E1
5.13
5.23
5.33
0.202
0.206
0.210
e
(2)
1.27 BSC.
0.050 BSC.
H
7.70
7.90
8.10
0.303
0.311
0.319
L
0.50
0.65
0.80
0.020
0.026
0.031
y
---
0.10
---
0.004
θ
---
---
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
相關(guān)PDF資料
PDF描述
WMS512K8-17CQ 512K X 8 STANDARD SRAM, 17 ns, CDIP32
WMS512K8-20FQ 512K X 8 STANDARD SRAM, 20 ns, CDFP36
WMS512K8-45CQ 512K X 8 STANDARD SRAM, 45 ns, CDIP32
WF2M32S-80G4TI 8M X 8 FLASH 5V PROM MODULE, 80 ns, CQFP68
WPF512K8C90TFM5 512K X 8 FLASH 5V PROM, 90 ns, PDSO32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q16CVDAAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSFAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSFAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI