
User’s Manual G12702EJ8V0UM00
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(B) Output circuit design
Check whether the load current used is a current no greater than the peak output current.
Connect a capacitor for abnormal oscillation prevention between output and GND of the power supply IC. If
transient load stability becomes a problem, make sure the capacitor is connected in parallel.
(C) Radiation design
The junction temperature can be calculated using the following expression.
TJ = (Rth(J-C) +
θC-HS + θHS) PD + TA ............................................................................................... (6.1)
Rth(J-C): Thermal resistance (junction to case)
θC-HS: Contact thermal resistance (includes thermal resistance of insulation sheet when using
insulation sheet)
θHS:
Thermal resistance of heatsink
PD:
Internal power dissipation of IC (PD = (VIN - VO)
IO + VIN IBIAS)
TA:
Operating ambient temperature
Expression (6.1) is the calculation expression when using a heatsink. When not using a heatsink, such as in
the
PC78L00 Series, use the following expression.
TJ = Rth(J-A)
PD + TA ...................................................................................................................... (6.2)
Rth(J-A): Thermal resistance (junction to ambient air)
Use the values in the data sheets for Rth(J-C) and Rth(J-A) in expressions (6.1) and (6.2).
Since TJ, Rth(J-C), PD, and TA are given, find the thermal resistance of the heatsink
θHS from them using
expression (6.1).
Figure 6-5 shows the thermal resistance of an aluminum board.
Since the heatsink
manufacturer produce heatsinks suited to power supply ICs, also consult the heatsink manufacturer.
Figure 6-5. Thermal Resistance of Aluminum Board
100
50
20
10
5
2
1
10
20
50 100 200
500 1000
Surface area of heatsink A (cm2)
Thermal
resistance
of
heatsink
HS
(
°C/W)
θ
t = 1.5 mm
t = 3 mm
If TJ is not within the design values, return to (A) or (B) and recalculate. An example of heatsink design is
shown next.