參數(shù)資料
型號(hào): TXS02326MRGER
廠商: Texas Instruments
文件頁數(shù): 10/35頁
文件大小: 0K
描述: IC SIM CARD MUX 2:1 24VQFN
產(chǎn)品培訓(xùn)模塊: Voltage Level Translation
標(biāo)準(zhǔn)包裝: 1
應(yīng)用: 移動(dòng)電話
接口: I²C
電源電壓: 1.7 V ~ 3.3 V
封裝/外殼: 24-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 24-VQFN 裸露焊盤(4x4)
包裝: 標(biāo)準(zhǔn)包裝
安裝類型: 表面貼裝
其它名稱: 296-28065-6
SCES795C
– SEPTEMBER 2010 – REVISED FEBRUARY 2011
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
Level Translator
(1)
MIN
MAX
UNIT
V_I/O
Supply voltage range
–0.3
4.0
V
V_I/O-port
–0.5
4.6
VI
Input voltage range
VSIMx-port
–0.5
4.6
V
Control inputs
–0.5
4.6
V_I/O-port
–0.5
4.6
Voltage range applied to any output in the high-impedance or
VO
V
power-off state
VSIMx-port
–0.5
4.6
V_I/O-port
–0.5
4.6
VO
Voltage range applied to any output in the high or low state
V
VSIMx-port
–0.5
4.6
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCCA or GND
±100
mA
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
LDO
(1)
MIN
MAX
UNIT
VIN
Input voltage range
–0.3
6
V
VOUT
Output voltage range
–0.3
6
V
TJ
Junction temperature range
–55
150
°C
Tstg
Storage temperature range
–55
150
°C
Human-Body Model (HBM)
2
kV
ESD rating
Charged-Device Model (CDM)
1000
V
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
18
2010–2011, Texas Instruments Incorporated
Product Folder Link(s): TXS02326
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