參數(shù)資料
型號: TPS65023QRSBRQ1
廠商: TEXAS INSTRUMENTS INC
元件分類: 電源管理
英文描述: POWER SUPPLY SUPPORT CKT, PQCC40
封裝: 5 X 5 MM, GREEN, PLASTIC, WQFN-40
文件頁數(shù): 12/54頁
文件大?。?/td> 1546K
代理商: TPS65023QRSBRQ1
SLVS927C – MARCH 2009 – REVISED MAY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VI
Input voltage range on all pins except AGND and PGND pins with respect to AGND
–0.3 V to 7 V
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3
2000 mA
Peak current at all other pins
1000 mA
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature
–40°C to 125°C
TJ
Maximum junction temperature
125°C
Tstg
Storage temperature
–65°C to 150°C
Human-body model (HBM)
2000 V
RHA package
Machine model (MM)
50 V
Charged-device model (CDM)
750 V
ESD
Electrostatic discharge protection
Human-body model (HBM)
2000 V
RSB package
Machine model (MM)
100 V
Charged-device model (CDM)
1000 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
DISSIPATION RATINGS
THERMAL RESISTANCE,
TA ≤ 25°C
TA = 70°C
TA = 85°C
PACKAGE
JUNCTION TO AMBIENT
POWER RATING
(RqJA)
RSB(1)
2.65 W
39°C/W
1.41 W
1.025 W
RHA(2)
3.175 W
31.5°C/W
1.746 W
1.269 W
(1)
The thermal resistance, junction-to-ambient (RqJA), of the RSB package is 39°C/W measured on a high-K board.
(2)
The thermal resistance, junction-to-ambient (RqJA), of the RHA package is 31.5°C/W measured on a high-K board.
2
Copyright 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
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