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參數(shù)資料
| 型號： | THS6012DWP |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 500-mA DUAL DIFFERENTIAL LINE DRIVER |
| 中文描述： | 500毫安雙差分線路驅(qū)動器 |
| 文件頁數(shù)： | 27/35頁 |
| 文件大?。?/td> | 604K |
| 代理商： | THS6012DWP |
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THS6012
500-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS226C– SEPTEMBER 1998 – REVISED FEBRUARY 2000
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
PCB design considerations (continued)
5.
When connecting these holes to the ground plane, do
not
use the typical web or spoke via connection
methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
However, in this application, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the THS6012 package should make their connection to the internal ground plane with a
complete connection around the entire circumference of the plated through hole.
6.
The top-side solder mask should leave exposed the terminals of the package and the thermal pad area with
its five holes. The four larger holes outside the thermal pad area, but still under the package, should be
covered with solder mask.
7.
Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals.
8.
With these preparatory steps in place, the THS6012 is simply placed in position and run through the solder
reflow operation as any standard surface-mount component. This results in a part that is properly installed.
Addition 6 vias outside of thermal pad area
but under the package
(Via diameter = 25 mils)
Thermal pad area (0.19 x 0.21) with 18 vias
(Via diameter = 13 mils)
Figure 45. PowerPAD PCB Etch and Via Pattern
The actual thermal performance achieved with the THS6012 in its PowerPAD package depends on the
application. In the previous example, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 21.5 C/W. For a given
θ
JA
, the maximum power dissipation
is shown in Figure 46 and is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case (0.37
°
C/W)
θ
CA
= Thermal coefficient from case to ambient
= Maximum power dissipation of THS6012 (watts)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS6012EVM | 功能描述:其他開發(fā)工具 THS6012 Hi-Spd Amp Eval Mods RoHS:否 制造商:Parallax 產(chǎn)品:ELEV-8 Hex Upgrade Kits 類型:Robotics 工具用于評估:ELEV-8 Quadcopter 工作電源電壓: |
| THS6012GQE | 制造商:TI 制造商全稱:Texas Instruments 功能描述:500-mA DUAL DIFFERENTIAL LINE DRIVER |
| THS6012IDWP | 功能描述:緩沖器和線路驅(qū)動器 500-mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6012IDWPG4 | 功能描述:緩沖器和線路驅(qū)動器 500mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6012IDWPR | 功能描述:緩沖器和線路驅(qū)動器 500-mA Dual Diff Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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