參數(shù)資料
型號(hào): THS3095DR
廠商: Texas Instruments, Inc.
英文描述: HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS
中文描述: 高壓,低失真,電流反饋運(yùn)算放大器
文件頁數(shù): 25/31頁
文件大?。?/td> 1083K
代理商: THS3095DR
www.ti.com
DESIGN TOOLS
Evaluation
Application Support
Fixtures,
Spice
Models,
and
4
3.5
3
2.5
2
1.5
1
0.5
0
40
20
0
20
40
60
80
100
PD
T
A
Free-Air Temperature
°
C
Results are With No Air Flow and PCB Size = 3”x 3”
θ
J
A
= 45.8
°
C/W for 8-Pin SOIC w/PowerPAD (DDA)
θ
J
A
= 58.4
°
C/W for 8-Pin MSOP w/PowerPAD (DGN)
θ
J
A
= 95
°
C/W for 8-Pin SOIC HighK Test PCB (D)
θ
J
A
= 158
°
C/W for 8-Pin MSOP w/PowerPAD w/o Solder
θ
JA
= 58.4
°
C/W
θ
JA
= 95
°
C/W
θ
JA
= 158
°
C/W
Τ
J
= 125
°
C
θ
JA
= 45.8
°
C/W
THS3091
THS3095
SLOS423C–SEPTEMBER 2003–REVISED AUGUST 2004
Texas Instruments is committed to providing its
customers with the highest quality of applications
support. To support this goal, an evaluation board
has been developed for the THS3091/5 operational
amplifier. The board is easy to use, allowing for
straightforward evaluation of the device. The evalu-
ation board can be ordered through the Texas
Instruments Web site, www.ti.com, or through your
local Texas Instruments sales representative.
Computer simulation of circuit performance using
SPICE is often useful when analyzing the perform-
ance of analog circuits and systems. This is particu-
larly true for video and RF-amplifier circuits where
parasitic capacitance and inductance can have a
major effect on circuit performance. A SPICE model
for the THS3091/5 is available through the Texas
Instruments Web site (www.ti.com). The Product
Information Center (PIC) is also available for design
assistance and detailed product information. These
models do a good job of predicting small-signal ac
and transient performance under a wide variety of
operating conditions. They are not intended to model
the distortion characteristics of the amplifier, nor do
they attempt to distinguish between the package
types in their small-signal ac performance. Detailed
information about what is and is not modeled is
contained in the model file itself.
Figure 73. Maximum Power Distribution vs
Ambient Temperature
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to consider not only quiescent power
dissipation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem.
25
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