1. PCB with a top-sid" />
參數(shù)資料
型號(hào)： THS3095DR
廠商： Texas Instruments, Inc.
英文描述： HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS
中文描述： 高壓，低失真，電流反饋運(yùn)算放大器
文件頁(yè)數(shù)： 24/31頁(yè)
文件大小： 1083K
代理商： THS3095DR
www.ti.com
PowerPAD LAYOUT CONSIDERATIONS
Figure 72. There should be etch for the leads as
well as etch for the thermal pad.
2. Place 13 holes in the area of the thermal pad.
These holes should be 10 mils in diameter. Keep
them small so that solder wicking through the
holes is not a problem during reflow.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad
area. This helps dissipate the heat generated by
the THS3091/5 IC. These additional vias may be
larger than the 10-mil diameter vias directly under
the thermal pad. They can be larger because
they are not in the thermal pad area to be
soldered so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
Note that the PowerPAD is electrically isolated
from the silicon and all leads. Connecting the
PowerPAD to any potential voltage such as V
S-
is
acceptable as there is no electrical connection to
the silicon.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
useful
for
slowing
the
soldering operations. This makes the soldering of
vias that have plane connections easier. In this
application, however, low thermal resistance is
desired for the most efficient heat transfer. There-
fore, the holes under the THS3091/5 PowerPAD
package should make their connection to the
internal ground plane with a complete connection
around
the
entire
plated-through hole.
6. The top-side solder mask should leave the ter-
minals of the package and the thermal pad area
with its 13 holes exposed. The bottom-side solder
mask should cover the 13 holes of the thermal
pad area. This prevents solder from being pulled
away from the thermal pad area during the reflow
process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
surface-mount component. This results in a part
that is properly installed.
POWER DISSIPATION AND THERMAL
CONSIDERATIONS
The
THS3091/5
incorporates
shutoff protection. This protection circuitry shuts down
the amplifier if the junction temperature exceeds
approximately 160
°
C. When the junction temperature
reduces to approximately 140
°
C, the amplifier turns
on
again.
But,
for
maximum
reliability, the designer must ensure that the design
does not exeed a junction temperature of 125
°
C.
Between 125
°
C and 150
°
C, damage does not occur,
but the performance of the amplifier begins to de-
grade and long-term reliability suffers. The thermal
characteristics of the device are dictated by the
package and the PC board. Maximum power dissi-
pation for a given package can be calculated using
the following formula.
P
Dmax
T
max
T
A
JA
where:
P
Dmax
is the maximum power dissipation in the amplifier (W).
T
max
is the absolute maximum junction temperature (
°
C).
T
A
is the ambient temperature (
°
C).
θ
JA
=
θ
JC
+
θ
CA
θ
JC
is the thermal coefficient from the silicon junctions to the
case (
°
C/W).
θ
CA
is the thermal coefficient from the case to ambient air
(
°
C/W).
THS3091
THS3095
SLOS423C–SEPTEMBER 2003–REVISED AUGUST 2004
automatic
thermal
performance
and
heat
transfer
during
For systems where heat dissipation is more critical,
the THS3091 and THS3095 are offered in an 8-pin
SOIC (DDA) with PowerPAD package. The thermal
coefficient for the PowerPAD packages are substan-
tially improved over the traditional SOIC. Maximum
power dissipation levels are depicted in the graph for
the available packages. The data for the PowerPAD
packages assume a board layout that follows the
PowerPAD layout guidelines referenced above and
detailed in the PowerPAD application note (literature
number
SLMA002
). The following graph also illus-
trates the effect of not soldering the PowerPAD to a
PCB. The thermal impedance increases substantially
which may cause serious heat and performance
issues. Be sure to always solder the PowerPAD to
the PCB for optimum performance.
circumference
of
the
as
any
standard
24
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