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參數(shù)資料
| 型號： | THS3095DR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS |
| 中文描述： | 高壓，低失真，電流反饋運(yùn)算放大器 |
| 文件頁數(shù)： | 23/31頁 |
| 文件大?。?/td> | 1083K |
| 代理商： | THS3095DR |
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DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
PowerPAD DESIGN CONSIDERATIONS
The
THS3091/5
thermally-enhanced PowerPAD family of packages.
These packages are constructed using a downset
leadframe on which the die is mounted [see Fig-
ure 71(a) and Figure 71(b)]. This arrangement results
0.140
0.060
0.060
0.010
vias
Top View
0.035
0.080
0.050
0.176
0.030
0.026
0.010
0.035
0.100
0.300
Pin 1
All Units in Inches
THS3091
THS3095
SLOS423C–SEPTEMBER 2003–REVISED AUGUST 2004
through onboard transmission lines. For short
connections, consider the trace and the input to
the next device as a lumped capacitive load.
Relatively wide traces (50 mils to 100 mils)
should be used, preferably with ground and
power planes opened up around them. Estimate
the total capacitive load and determine if isolation
resistors on the outputs are necessary. Low
parasitic capacitive loads (< 4 pF) may not need
an R
S
because the THS3091/5 are nominally
compensated to operate with a 2-pF parasitic
load. Higher parasitic capacitive loads without an
RS are allowed as the signal gain increases
(increasing the unloaded phase margin). If a long
trace is required, and the 6-dB signal loss intrin-
sic to a doubly terminated transmission line is
acceptable, implement a matched impedance
transmission line using microstrip or stripline
techniques (consult an ECL design handbook for
microstrip and stripline layout techniques). A
50-
environment is not necessary onboard, and
in
fact,
a
higher
impedance
improves distortion as shown in the distortion
versus load plots. With a characteristic board
trace impedance based on board material and
trace dimensions, a matching series resistor into
the trace from the output of the THS3091/5 is
used as well as a terminating shunt resistor at the
input of the destination device. Remember also
that the terminating impedance is the parallel
combination of the shunt resistor and the input
impedance of the destination device; this total
effective impedance should be set to match the
trace impedance. If the 6-dB attenuation of a
doubly terminated transmission line is unaccept-
able, a long trace can be series-terminated at the
source end only. Treat the trace as a capacitive
load in this case. This does not preserve signal
integrity as well as a doubly terminated line. If the
input impedance of the destination device is low,
there is some signal attenuation due to the
voltage divider formed by the series output into
the terminating impedance.
Socketing a high-speed part like the THS3091/5
is not recommended. The additional lead length
and pin-to-pin capacitance introduced by the
socket can create an extremely troublesome
parasitic network which can make it almost im-
possible to achieve a smooth, stable frequency
response. Best results are obtained by soldering
the THS3091/5 parts directly onto the board.
in the lead frame being exposed as a thermal pad on
the underside of the package [see Figure 71(c)].
Because this thermal pad has direct thermal contact
with the die, excellent thermal performance can be
achieved by providing a good thermal path away from
the thermal pad. Note that devices such as the
THS3091/5 have no electrical connection between
the PowerPAD and the die.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing oper-
ation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package
into
either
a
heat-dissipating device.
ground
plane
or
other
The PowerPAD package represents a breakthrough
in combining the small area and ease of assembly of
surface
mount
with
the,
mechanical methods of heatsinking.
heretofore,
awkward
environment
Figure 71. Views of Thermal Enhanced Package
Although there are many ways to properly heatsink
the PowerPAD package, the following steps illustrate
the recommended approach.
are
available
in
a
Figure 72. DDA PowerPAD PCB Etch and Via
Pattern
23
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| THS3095DRG4 | 功能描述:高速運(yùn)算放大器 Single Lo-Distort Current Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3095EVM | 功能描述:放大器 IC 開發(fā)工具 THS3095 Eval Module RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| THS3096 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS |
| THS3096D | 功能描述:高速運(yùn)算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3096DG4 | 功能描述:高速運(yùn)算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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