參數(shù)資料
型號: TFP513PAP
廠商: Texas Instruments, Inc.
英文描述: TI PANELBUS DIGITAL TRANSMITTER
中文描述: 德州儀器PANELBUS數(shù)字發(fā)射機
文件頁數(shù): 27/29頁
文件大?。?/td> 424K
代理商: TFP513PAP
SLLS611 AUGUST 2004
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PAP (S-PQFP-G64)
PowerPAD
PLASTIC QUAD FLATPACK
Thermal Pad
(See Note D)
0,13 NOM
0,25
0,45
0,75
Seating Plane
4147702/A 01/98
Gage Plane
0,17
0,27
33
16
48
1
7,50 TYP
10,20
49
64
SQ
9,80
12,20
1,05
0,95
11,80
1,20 MAX
SQ
17
32
0,08
0,50
M
0,08
0
°
7
°
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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