參數(shù)資料
型號(hào)： TE28F256P30T85
廠商： INTEL CORP
元件分類(lèi)： DRAM
英文描述： Intel StrataFlash Embedded Memory
中文描述： 16M X 16 FLASH 1.8V PROM, 88 ns, PDSO56
封裝： 14 X 20 MM, TSOP-56
文件頁(yè)數(shù)： 48/102頁(yè)
文件大?。?/td> 1609K
代理商： TE28F256P30T85
1-Gbit P30 Family
April 2005
48
Intel StrataFlash
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
9.0
Device Operations
This section provides an overview of device operations. The system CPU provides control of all in-
system read, write, and erase operations of the device via the system bus. The on-chip Write State
Machine (WSM) manages all block-erase and word-program algorithms.
Device commands are written to the Command User Interface (CUI) to control all flash memory
device operations. The CUI does not occupy an addressable memory location; it is the mechanism
through which the flash device is controlled.
9.1
Bus Operations
CE# low and RST# high enable device read operations. The device internally decodes upper
address inputs to determine the accessed block. ADV# low opens the internal address latches. OE#
low activates the outputs and gates selected data onto the I/O bus.
In asynchronous mode, the address is latched when ADV# goes high or continuously flows through
if ADV# is held low. In synchronous mode, the address is latched by the first of either the rising
ADV# edge or the next valid CLK edge with ADV# low (WE# and RST# must be V
IH
; CE# must
be V
IL
).
Bus cycles to/from the P30 device conform to standard microprocessor bus operations.
Table 19
summarizes the bus operations and the logic levels that must be applied to the device control signal
inputs.
9.1.1
Reads
To perform a read operation, RST# and WE# must be deasserted while CE# and OE# are asserted.
CE# is the device-select control. When asserted, it enables the flash memory device. OE# is the
data-output control. When asserted, the addressed flash memory data is driven onto the I/O bus.
See
Section 10.0, “Read Operations” on page 53
for details on the available read modes, and see
Section 14.0, “Special Read States” on page 75
for details regarding the available read states.
Table 19.
Bus Operations Summary
Bus Operation
RST#
CLK
ADV#
CE#
OE#
WE#
WAIT
DQ[15:0]
Notes
Read
Asynchronous
V
IH
V
IH
X
L
L
L
H
Deasserted
Output
Synchronous
Running
L
L
L
H
Driven
Output
Write
V
IH
X
L
L
H
L
High-Z
Input
1
Output Disable
V
IH
V
IH
X
X
L
H
H
High-Z
High-Z
2
Standby
X
X
H
X
X
High-Z
High-Z
2
Reset
V
IL
X
X
X
X
X
High-Z
High-Z
2,3
Notes:
1.
2.
3.
Refer to the
Table 20, “Command Bus Cycles” on page 50
for valid DQ[15:0] during a write operation.
X = Don’t Care (H or L).
RST# must be at V
SS
± 0.2 V to meet the maximum specified power-down current.
相關(guān)PDF資料
PDF描述
TE28F640P30B85 Intel StrataFlash Embedded Memory
TE28F640P30T85 Intel StrataFlash Embedded Memory
TE28F128P30B85 Intel StrataFlash Embedded Memory
TE28F160B3-B120 SMART 3 ADVANCED BOOT BLOCK WORD-WIDE
TE28F800B3-B120 SMART 3 ADVANCED BOOT BLOCK WORD-WIDE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TE28F256P30T95 制造商:NUMONYX 制造商全稱(chēng):Numonyx B.V 功能描述:Numonyx StrataFlash Embedded Memory
TE28F256P30T95A 功能描述:IC FLASH 256MBIT 95NS 56TSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:StrataFlash™ 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SRAM - 同步，DDR II 存儲(chǔ)容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤(pán) 其它名稱(chēng):71P71804S200BQ
TE28F256P30TFA 功能描述:IC FLASH 256MBIT 110NS 56TSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:Axcell™ 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SRAM - 同步，DDR II 存儲(chǔ)容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤(pán) 其它名稱(chēng):71P71804S200BQ
TE28F256P33B95A 功能描述:IC FLASH 256MBIT 95NS 56TSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:StrataFlash™ 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:32K (4K x 8) 速度:100kHz，400kHz 接口:I²C，2 線(xiàn)串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) 其它名稱(chēng):CAV24C32WE-GT3OSTR
TE28F256P33BFA 功能描述:IC FLASH 256MBIT 105NS 56TSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:Axcell™ 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:32K (4K x 8) 速度:100kHz，400kHz 接口:I²C，2 線(xiàn)串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) 其它名稱(chēng):CAV24C32WE-GT3OSTR
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*