參數(shù)資料
型號: TE28F016C3T90
廠商: Intel Corp.
英文描述: 3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
中文描述: 3伏高級啟動塊8 - ,16 - ,32 - Mbit閃存家庭
文件頁數(shù): 8/59頁
文件大小: 384K
代理商: TE28F016C3T90
3 VOLT ADVANCED+ BOOT BLOCK
E
8
PRODUCT PREVIEW
A
13
A
11
A
8
V
PP
WP#
A
7
A
4
A
B
C
D
E
F
1
2
3
4
5
6
7
8
A
14
A
10
WE#
RP#
A
18
A
17
A
5
A
2
A
15
A
12
A
9
A
6
A
3
A
1
A
16
D
14
D
5
D
11
D
2
D
8
CE#
A
0
V
CCQ
D
15
D
6
D
12
D
3
D
9
D
0
GND
GND
D
7
D
13
D
4
V
CC
D
10
D
1
OE#
A
19
16M
A
20
32M
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A
19
is the upgrade address for the 16-Mbit device. A
20
is the
upgrade address for the 32-Mbit device.
8-Mbit not available on
μ
BGA* CSP.
Figure 3. x16 48-Ball
μ
BGA* Chip Size Package (Top View, Ball Down)
2.
A
14
A
12
A
8
V
PP
WP#
A
7
A
4
A
B
C
D
E
F
1
2
3
4
5
6
7
8
A
15
A
10
WE#
RP#
A
19
A
18
A
5
A
2
A
16
A
13
A
9
A
6
A
3
A
1
A
17
NC
D
5
NC
D
2
NC
CE#
A
0
V
CCQ
A
11
D
6
NC
D
3
NC
D
0
GND
GND
D
7
NC
D
4
V
CC
NC
D
1
OE#
A
20
A
21
32M
16M
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A
20
is the upgrade address for the 16-Mbit device. A
21
is the
upgrade address for the 32-Mbit device.
8-Mbit not available on
μ
BGA* CSP.
Figure 4
. x8 48-Ball μBGA* Chip Size Package (Top View, Ball Down)
2.
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