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參數(shù)資料
| 型號： | TDA9923AHW |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 4-CH 12-BIT RESISTANCE LADDER ADC, SERIAL ACCESS, PQFP48 |
| 封裝： | 7 X 7 MM, 1.00 MM HEIGHT, PLASTIC, MS-026, SOT545-3, QFP-48 |
| 文件頁數(shù)： | 10/20頁 |
| 文件大?。?/td> | 118K |
| 代理商： | TDA9923AHW |
9397 750 14207
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 6 February 2006
18 of 20
Philips Semiconductors
TDA9923A
Quad 12-bit, up to 40 Msample/s analog-to-digital converter
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reow soldering with
peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Revision history
Table 11:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
TDA9923A_1
20060206
Objective data sheet
-
9397 750 14207
-
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