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參數(shù)資料
| 型號： | TDA9887TS/V3 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| 封裝： | 5.30 MM, PLASTIC, MO-150, SOT-340-1, SSOP-24 |
| 文件頁數(shù)： | 47/56頁 |
| 文件大?。?/td> | 230K |
| 代理商： | TDA9887TS/V3 |
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2002 Mar 05
51
Philips Semiconductors
Product specication
I2C-bus controlled multistandard alignment-free
IF-PLL demodulator with FM radio
TDA9887TS
15.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
16 DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specication for product
development. Philips Semiconductors reserves the right to change the
specication in any manner without notice.
Preliminary data
Qualication
This data sheet contains data from the preliminary specication.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specication without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specication. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notication (CPCN) procedure SNW-SQ-650A.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TDA9888 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DVB selective AGC amplifier |
| TDA9888TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DVB selective AGC amplifier |
| TDA9889 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DVB selective AGC amplifier |
| TDA9889TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DVB selective AGC amplifier |
| TDA9889TS/V1,512 | 功能描述:射頻放大器 DVB T AFRIC DOWN CONVERSION RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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