參數(shù)資料
型號(hào)： TDA8754EL/14
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
封裝： 17 X 17 MM, 1.05 MM HEIGHT, LOW PROFILE, PLASTIC, SOT-774-1, MO-192, BGA-208
文件頁(yè)數(shù)： 50/57頁(yè)
文件大?。?/td> 264K
代理商： TDA8754EL/14
9397 750 14984
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2005
54 of 57
Philips Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msps
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
相關(guān)PDF資料
PDF描述
TDA8754HL/14 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754HL/21 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754EL/21 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754HL/11 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754EL/11 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8754H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed ADC for LCD drive
TDA8754HL/11/C1,51 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1,55 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1/R1 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8-BIT VID INTERFACE 110 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1/R1,518 制造商:NXP Semiconductors 功能描述:
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