參數(shù)資料
型號(hào)： TDA8754EL/14
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
封裝： 17 X 17 MM, 1.05 MM HEIGHT, LOW PROFILE, PLASTIC, SOT-774-1, MO-192, BGA-208
文件頁(yè)數(shù)： 49/57頁(yè)
文件大小： 264K
代理商： TDA8754EL/14
9397 750 14984
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 06 — 16 June 2005
53 of 57
Philips Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msps
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°C
or 265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in most
applications.
16.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the at part of the lead. Contact time must be
limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°C and 320 °C.
16.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reow soldering with
peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow oven. The package
body peak temperature must be kept as low as possible.
Table 77:
Suitability of surface mount IC packages for wave and reow soldering methods
Package [1]
Soldering method
Wave
Reow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
相關(guān)PDF資料
PDF描述
TDA8754HL/14 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754HL/21 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754EL/21 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754HL/11 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8754EL/11 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
相關(guān)代理商/技術(shù)參數(shù)
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TDA8754H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed ADC for LCD drive
TDA8754HL/11/C1,51 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1,55 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 TRPL 8BIT VIDEO ADC RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1/R1 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8-BIT VID INTERFACE 110 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8754HL/11/C1/R1,518 制造商:NXP Semiconductors 功能描述:
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