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TCM38C17IDL
QCombo
FOUR-CHANNEL (QUAD) PCMCOMBO
SLWS040C – JUNE 1996 – REVISED OCTOBER 1999
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Single 5-V Supply
Replaces Four TCM29C13-Type Combos
(CODEC and Filters)
Meets CCITT/(D3/D4) G.711 and G.714
Channel Bank Specifications
Advanced Switched-Capacitor Filters and
Sigma-Delta A/D and D/A Converter
Technology With DSP Filtering
μ
-Law or A-Law Companding —
Pin-Selectable
2.048 MHz Operation
8 Vpp Full-Signal Differential Receiver
Output
Differential Signal Processing Architecture
Low Crosstalk (< –100 dB),
Low Idle-Channel Noise, and
Good Power Supply Rejection
Single PCM I/O for Simplified PCM Interface
Reliable Submicron Silicon-Gate CMOS
Technology
description
The TCM38C17IDL QCombo
is a 4-channel
single-chip PCM combo (pulse-code-modulated
CODEC with a voice-band filtering) device. It
performs the transmit encoding (A/D conversion)
and receive decoding (D/A conversion), as well as the transmit and receive filtering functions required to meet
CCITT G.711 and G.714 specifications in a PCM system. Each channel provides all the functions required to
interface a full-duplex, 4-line voice telephone circuit with a TDM (time-division-multiplexed) system. The
TCM38C17IDL is specifically designed for fixed-data-rate applications and is intended to replace four
TCM29C13-type devices.
Primary applications include digital transmission and switching of E1 carrier, PABX (private automatic branch
exchange), and central office telephone systems and subscriber line concentrators. The device serves as the
analog termination of a PCM line or trunk to the POTS (plain old telephone system) local-loop line.
Other applications include any PCM digital-audio interface such as voice-band data storage systems and many
digital signal processing applications that can benefit from the reduced footprint of a quad codec configuration
and single-rail operation. Dynamic range and excellent idle-channel noise performance are maintained using
the TI advanced 4Vt process technologies.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
TI and QCombo are registered trademarks of Texas Instruments, Inc.
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DL PACKAGE
(TOP VIEW)
RBIAS
AREF
AVSS
0GSX
0ANLGIN–
0ANLGIN+
0PWRO+
0GSR
0PWRO–
1GSX
1ANLGIN–
1ANLGIN+
1PWRO+
1GSR
1PWRO–
0PDN
1PDN
VSS
DVSS
DVDD
DVDDPLL
MCLK
DVSSPLL
ASEL
REFLTR1
REFLTR2
AVDD
2GSX
2ANLGIN–
2ANLGIN+
2PWRO+
2GSR
2PWRO–
3GSX
3ANLGIN–
3ANLGIN+
3PWRO+
3GSR
3PWRO–
3PDN
2PDN
0FS
1FS
2FS
3FS
PCMOUT
RESET
PCMIN