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參數(shù)資料
| 型號： | TAS5110ADADR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | PurePath Digital AMPLIFIER TAS5110A 50-W DIGITAL AMPLIFIER POWER STAGE |
| 中文描述： | PurePath Digital數(shù)字功放TAS5110A 50 - W數(shù)字放大器功率級 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 165K |
| 代理商： | TAS5110ADADR |
TAS5110A
SLES079A
–
APRIL 2003
–
REVISED MAY 2003
www.ti.com
13
THERMAL INFORMATION
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220 type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have two shortcomings: they do not address the low profile requirements (<2 mm) of many of today
’
s
advanced systems, and they do not offer a terminal count that is high enough to accommodate increasing integration.
On the other hand, traditional low-power surface-mount packages require power-dissipation derating that severely
limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PCB. Because of the very small size and
limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal conduction paths
that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved. See the dissipation derating table.
DIE
End View DAD
Thermal
Pad
Top View DAD
DAD Package
Figure 6. View of Thermally Enhanced DAD Package
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TAS5110ADADRG4 | 功能描述:音頻放大器 50W Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DAD | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADG4 | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADR | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADRG4 | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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