
Revision V1.7/October 2010
2010 Semtech Corp.
SX8652
www.semtech.com
Page 3
Section
Page
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
Table of contents
9.6.
Register Map................................................................................................................................................. 22
9.7.
SX8652 register ............................................................................................................................................ 23
10.
Application Information ......................................................................................................................................... 24
10.1.
Acquisition Setup ........................................................................................................................................... 24
10.2.
Channel Selection.......................................................................................................................................... 24
10.3.
Noise Reduction............................................................................................................................................. 24
10.3.1. POWDLY................................................................................................................................................. 24
10.3.2. SETDLY .................................................................................................................................................. 25
10.4.
AUX Input - 4-wire touchscreen only ............................................................................................................. 25
10.5.
Interrupt Generation....................................................................................................................................... 25
10.6.
Coordinate Throughput Rate ......................................................................................................................... 25
10.6.1. SPI Communication Time ....................................................................................................................... 25
10.6.2. Conversion Time ..................................................................................................................................... 26
10.7.
ESD event...................................................................................................................................................... 26
11.
Packaging Information ........................................................................................................................................... 27
11.1.
DFN Package................................................................................................................................................. 27
11.2.
WLCSP Package ........................................................................................................................................... 28