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參數(shù)資料
| 型號： | SSTUA32866EC/G,557 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 鎖存器 |
| 英文描述： | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| 封裝： | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 |
| 文件頁數(shù)： | 16/28頁 |
| 文件大?。?/td> | 153K |
| 代理商： | SSTUA32866EC/G,557 |
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SSTUA32866_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 26 March 2007
23 of 28
NXP Semiconductors
SSTUA32866
1.8 V DDR2-667 congurable registered buffer with parity
13. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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| SSTUAF32866BHLFT | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96 |
| SSTUAF32869AHLFT | 32869 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA150 |
| SSTUB32864EC/G | 32864 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| SSTUB32868ET/S | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA176 |
| SSTUG32865ET/S | SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SSTUA32S865 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-667 RDIMM applications |
| SSTUA32S865BHLF | 功能描述:IC REGIST BUFF 25BIT DDR 160BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32S865BHLFT | 功能描述:IC REGIST BUFF 25BIT DDR 160BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32S865ET | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-667 RDIMM applications |
| SSTUA32S865ET,518 | 功能描述:寄存器 1.8V 28BT REGBUFF/PAR-DDR2-667 RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
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